Daily Archives: February 5, 2015
Samsung has started mass production of embedded package-on-package (ePoP) memory for smartphones that would result in slimmer electronics and devices.
The South Korean firm started had producing ePoP for wearables last year. It announced new tech that combines a dynamic random-access memory (DRAM) and NAND flash into one chip that could be stacked above an application processor, resulting in 40 percent less space utilization, allowing slimmer handset designs.
ePoP offers high capacity and reading speeds, it combines 3GB LPDDR3 mobile DRAM module with a 32GB embedded multimedia card at an I/O data transfer rate of 1,866Mb/s, and sports a 64-bit I/O bandwidth.
Samsung plans to expand its line-up of ePoP memory with packages involving enhancements in performance and density over the next few years. It is already offering a similar single-package solution for wearable devices, referred to as “wearable memory”. The electronics giant says that the new configuration for phones can be customized not only for use in flagship smartphones but also in other devices such as high-end tablets.
Jeeho Baek, Senior Vice President of Memory Marketing at Samsung Electronics had this to say about the new technology:
“By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features. We plan to expand our line-up of ePoP memory with packages involving enhancements in performance and density over the next few years, to further add to the growth of premium mobile market.”